February 25, 2024
Lamination Adhesives For Flexible Packaging Market

Lamination Adhesives For Flexible Packaging Market is driven by increasing demand for flexible packaging solutions

Lamination adhesives enable bonding between substrate films, primers, and thermoplastics creating laminated structures that provide flexible barrier protection and ease of handling for packaged goods. They ensure seamless lamination of multi-layered packaging films offering high strength and durability necessary for applications like pouches, bags, and wraps used extensively across food, beverages, pharmaceuticals and other consumer goods sectors. The global flexible packaging industry has witnessed rapid growth driven by shifting preferences towards convenient packaging from both manufacturers as well as consumers. Lamination adhesives facilitate production of sophisticated laminated films required to deliver extended shelf life while maintaining product freshness and quality for packaged snacks, frozen food, confectionery, healthcare products and more.

The global Lamination Adhesives for Flexible Packaging Market is estimated to be valued at US$ 2.88 Bn in 2024 and is expected to exhibit a CAGR of 12% over the forecast period 2024 to 2031, as highlighted in a new report published by Coherent Market Insights.

Market key trends:

Bio-based and eco-friendly adhesives are gaining ground in the lamination adhesives market owing to stringent regulations around sustainability and circular economy. Leading adhesive manufacturers are focusing on developing bio-polyurethane, bio-polyamide and other plant-based resins from renewable sources like vegetable oils and carbohydrates as viable green alternatives to conventional petroleum-derived adhesives. Water-based formulations are also witnessing heightened demand attributable to their lower VOC content and solvent-free composition making them safer for employees and environmentally compliant. Lamination adhesive suppliers continue investing in innovative product ranges to meet the customization needs of flexible packaging converters. New dual-cure, high bonding strength adhesives tailored for multi-layered packaging structures and capabilities like extended open assembly time and gap-filling properties are expanding application scope of lamination adhesives in the industry.

Porter’s Analysis

Threat of new entrants: The threat of new entrants is moderately low in the lamination adhesives for flexible packaging market due to the presence of established players and the requirement of large investments.

Bargaining power of buyers: The bargaining power of buyers is high as lamination adhesives are commoditized products and buyers have a variety of options available from different manufacturers.

Bargaining power of suppliers: The bargaining power of suppliers is moderate as there are numerous raw material suppliers for lamination adhesives in the market.

Threat of new substitutes: The threat of new substitutes is low as lamination adhesives are core to the flexible packaging production process and there aren’t viable substitutes.

Competitive rivalry: The competitive rivalry is high due to the presence of numerous regional and global players competing on factors like pricing, product differentiation, and marketing.

Key Takeaways

The Global Lamination Adhesives For Flexible Packaging Market Demand is expected to witness high growth over the forecast period.

Asia Pacific region currently dominates the market and is expected grow at the fastest pace due to rising consumption of flexible packaging in countries like China and India.

Key players operating in the lamination adhesives for flexible packaging market are Leica Biosystems Nussloch GmbH, Olympus Corporation, F. Hoffmann-La Roche Ltd., Merck KGaA, GE Healthcare, Mikroscan Technologies, Inc., Koninklijke Philips N.V., Sectra AB, Propath UK Limited, Inspirata, Inc., Hamamatsu Photonics, Inc., OracleBio Limited, MD Biosciences, Aiforia, Xybion Digital Inc., Nucleai, Inc.

*Note:
1. Source: Coherent Market Insights, Public sources, Desk research
2. We have leveraged AI tools to mine information and compile it